Dynasolve FS8320 is a semi-aqueous defluxer designed to be effective at the removal of baked-on solvent-based flux residues. It is an excellent choice for removal of flux residues from wafers after the bumping process. Dynasolve FS8320 is exceptionally safe on all solder types including lead-free, high-lead, and eutectic. It can also be used for removal of misprinted photoresists.

Benefits

• Short process time

• High flash point

• Low process temperature

• Multimetal safe

• Safe for all solder types

• Water rinsable

• Use in immersion or SST

• High resin loading; long bath life